NAME

Huang Hui

Paper Publications

Development of a brazed diamond wire for slicing single-crystal SiC ingots
  • Hits:
  • Journal:

    INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

  • Place of Publication:

    2016JCR大类-工程技术3区

  • Note:

    2018年考核

  • Page Number:

    189-199

  • Translation or Not:

    no

  • First Author:

    XXP,尹芳(学),Huang Hui,何钊滨(学)

Pre One:多线摇摆往复式线锯切割加工运动的理论及实验研究

Next One:An Experimental Research on the Force and Energy During the Sapphire Sawing Using Reciprocating Electroplated Diamond Wire Saw
Recommended Ph.D.Supervisor Recommended MA Supervisor

Xiamen Campus: No.668 Jimei Avenue, Xiamen, Fujian, China 361021    Quanzhou Campus: No.269 Chenghua North Rd. Quanzhou, Fujian, China 362021

Click:

Open time:..
The Last Update Time:..