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Huang Hui

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Professor  
Supervisor of Doctorate Candidates  
Supervisor of Master's Candidates  

Paper Publications

Effect of wire vibration on the materials loss in sapphire slicing with the fixed diamond wire

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Journal:MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING

Place of Publication:2016JCR大类-工程技术3区

Note:2018年考核

Translation or Not:no

Date of Publication:2016-11-01

First Author:XXP,王思佩(学),Huang Hui

Pre One:An Experimental Research on the Force and Energy During the Sapphire Sawing Using Reciprocating Electroplated Diamond Wire Saw

Next One:Mechanical wear of different crystallographic orientations for single abrasive diamond scratching on Ta12W