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江开勇

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Paper Publications

An Experimental Study on Microware Welding Technology of CuW to Cu Substrate

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Journal:Advanced Materials Research Vol.703

Translation or Not:no

Date of Publication:2012-12-05

First Author:WF,ZJL,JKY

Pre One:A new method for stereo matching based on fiducial marker

Next One:Performance and microstructure of TiN/Cu EDM electrodes

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