华侨大学罗求发--中文主页--科学研究

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罗求发

副教授硕士生导师

科学研究

1. 新型半导体材料和器件的超精密磨抛加工

2. 微纳米尺度磨料表面改性

3. 多能场辅助超精密抛光技术

4. 新型磨抛工具设计制备

[1] 【一作-SCI】Fabrication and Application of Grinding Wheels with Soft and Hard Composite Structures for Silicon Carbide Substrate Precision Processing.Materials.2024
[2] 【一作-EI】碳化硅衬底磨抛加工技术的研究进展与发展趋势.湖南大学学报（自然科学版）.2024
[3] 【一作-SCI】Tribochemical mechanisms of abrasives for SiC and sapphire substrates in nanoscale polishing.Nanoscale.2023
[4] 【一作-SCI】Sol-gel polishing technology for extremely hard semiconductor substrates.INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY.2022
[5] 【一作-EI】单层磨料凝胶抛光垫的加工性能研究.表面技术.2021
[6] 【一作-SCI】Controllable material removal behavior of 6H-SiC wafer in nanoscale polishing.Applied Surface Science.2021

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