Research Projects
多晶金刚石晶圆激光修平及研磨技术开发
Release time:2025-09-07 Hits:
Supported by:广州梦钻科技有限公司
Nature of Project:Other technology services
Supported by:Other projects
Project level:Other
Project Number:2025HH505
Date of Project Completion:2026-07-23
Date of Project Initiation:2025-07-24
Subsidy Amount(¥):17.0

