Affilication of Author(s):华侨大学
Scope of patent:G01B5/08(用于计量直径)
Patent Applicant:华侨大学
Disigner of the Invention:Dingrong Yi,Dingrong Yi,Dingrong Yi,朱星星,胡欢欢,杨泽宇
Type of Patent:发明专利
State of Patent:审中-实质审查
Application Number:CN202011590137.9
Number of Inventors:4
Service Invention or Not:no
Application Date:2020-12-29
Publication Date:2021-03-19
First Author:Dingrong Yi,Dingrong Yi,Dingrong Yi,Dingrong Yi