Patents
一种碳化硅研磨表面残余应力预测方法及装置
- Patent Applicant:李松宴,杨晓,卓荣锦
- Type of Patent:Invent
- State of Patent:Authorized patents
- Service Invention or Not:no
- First Author:邓朝晖
Next One:一种碳化硅衬底研磨材料去除率的预测方法及装置
Teacher Personal
Homepage
Xiamen Campus: No.668 Jimei Avenue, Xiamen, Fujian, China 361021 Quanzhou Campus: No.269 Chenghua North Rd. Quanzhou, Fujian, China 362021