NAME

黄国钦

Patents

一种磨粒三维有序排布装置、方法及增材制造设备
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  • Patent Applicant:

    华侨大学

  • Disigner of the Invention:

    XXP,Yangli Xu,王建宇,黄魏峰,HGQ

  • Type of Patent:

    Invent

  • Application Number:

    CN202511892738.8

  • Service Invention or Not:

    no

  • First Author:

    HGQ

Next One:一种增材制造铣磨头及其一体化成型的批量制造方法
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Xiamen Campus: No.668 Jimei Avenue, Xiamen, Fujian, China 361021    Quanzhou Campus: No.269 Chenghua North Rd. Quanzhou, Fujian, China 362021

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