华侨大学黄国钦--中文主页-- Simulation of temperature on the wettability behavior of diamond/ Cu-based filler alloys during brazing process

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Simulation of temperature on the wettability behavior of diamond/ Cu-based filler alloys during brazing process

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发表刊物：JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY

论文类型：期刊论文

是否译文：否

发表时间：2026-03-01

收录刊物：SCI

第一作者：Yang Hu

通讯作者：Huang Guoqin

上一条：Multi-level feature-based cross-domain SOH prediction for lithium-ion batteries with dual-stage loss

下一条：Investigation of suppressing diamond displacement during brazing by adding 304L stainless steel particles into Ni-Cr-P alloys