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Huang Hui

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Professor  
Supervisor of Doctorate Candidates  
Supervisor of Master's Candidates  

Paper Publications

Effect of wire vibration on the materials loss in sapphire slicing with the fixed diamond wire

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Affiliation of Author(s):制造工程研究院

Journal:MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING

Indexed by:Journal paper

Translation or Not:no

Date of Publication:2017-11-01

First Author:Huang Hui

Correspondence Author:王思佩,XXP

Pre One:Development of a brazed diamond wire for slicing single-crystal SiC ingots

Next One:An Experimental Research on the Force and Energy During the Sapphire Sawing Using Reciprocating Electroplated Diamond Wire Saw