NAME

Huang Hui

Paper Publications

Development of a brazed diamond wire for slicing single-crystal SiC ingots
  • Hits:
  • Affiliation of Author(s):

    制造工程研究院

  • Journal:

    INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

  • Indexed by:

    Journal paper

  • Translation or Not:

    no

  • First Author:

    何钊滨

  • Correspondence Author:

    Huang Hui,尹芳,XXP

Pre One:金刚石磨粒与蓝宝石接触形式对其磨损性能的影响

Next One:Effect of wire vibration on the materials loss in sapphire slicing with the fixed diamond wire
Recommended Ph.D.Supervisor Recommended MA Supervisor

Xiamen Campus: No.668 Jimei Avenue, Xiamen, Fujian, China 361021    Quanzhou Campus: No.269 Chenghua North Rd. Quanzhou, Fujian, China 362021

Click:

Open time:..
The Last Update Time:..