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Huang Hui

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Professor  
Supervisor of Doctorate Candidates  
Supervisor of Master's Candidates  

Paper Publications

Development of a brazed diamond wire for slicing single-crystal SiC ingots

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Affiliation of Author(s):制造工程研究院

Journal:INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY

Indexed by:Journal paper

Translation or Not:no

Date of Publication:2017-07-01

First Author:何钊滨

Correspondence Author:Huang Hui,尹芳,XXP

Pre One:金刚石磨粒与蓝宝石接触形式对其磨损性能的影响

Next One:Effect of wire vibration on the materials loss in sapphire slicing with the fixed diamond wire