黄辉
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发表刊物:MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING
刊物所在地:2016JCR大类-工程技术3区
备注:2018年考核
是否译文:否
发表时间:2016-11-01
第一作者:徐西鹏,王思佩(学),黄辉
上一条:An Experimental Research on the Force and Energy During the Sapphire Sawing Using Reciprocating Electroplated Diamond Wire Saw
下一条:Mechanical wear of different crystallographic orientations for single abrasive diamond scratching on Ta12W