Doctoral Degree in Engineering

博士研究生

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Professor Supervisor of Doctorate Candidates

  • Academic Titles:厦门市光电材料加工重点实验室副主任
  • Education Level:博士研究生
  • Degree:Doctoral Degree in Engineering
  • School/Department:制造工程研究院
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  • Other Post:国际磨粒加工委员会（ICAT）青年委员，中国机械工程学会生产工程分会光整加工专业委员会理事，稀土抛光材料与界表面调控加工技术专业委员会副主任委员，福建省机械工程学会标准委员会委员

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    Home > Scientific Research > Paper Publications

    Study on planarization machining of sapphire wafer with soft-hard mixed abrasive through mechanical chemical polishing

    Release time:2023-04-04 Hits:

    Affiliation of Author(s):制造工程研究院
     Journal:APPLIED SURFACE SCIENCE
     Indexed by:Journal paper
     Translation or Not:no
     Date of Publication:2016-12-01
     First Author:许永超
     Correspondence Author:LJ,XXP

    Pre One:Study on the processing characteristics of SiC and sapphire substrates polished by semi-fixed and fixed abrasive tools

    Next One:Preparation and Characterization of Zirconia-Coated Nanodiamonds as a Pt Catalyst Support for Methanol Electro-Oxidation

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