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Doctoral Degree in Engineering
博士研究生
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Professor Supervisor of Doctorate Candidates
Academic Titles:厦门市光电材料加工重点实验室副主任
Education Level:博士研究生
Degree:Doctoral Degree in Engineering
School/Department:制造工程研究院
E-Mail:
43d9546ff93deca1cef1f5ea49e124553b90a6ef29da0a4198b346e7b56872e6b2ef26e06817bd34b15dc94a88a95f72254ce1ea4caf79142a80c53962fcf92a4a5a5e39b79ece9c64da79bc3dbed5a134ba90686bdce65668e62976c905c2f426e1b8a03d682d4e77fe367d769425bd573d02d985870ed1f9a48cdbbf8513c2
Other Post:国际磨粒加工委员会（ICAT）青年委员，中国机械工程学会生产工程分会光整加工专业委员会理事，稀土抛光材料与界表面调控加工技术专业委员会副主任委员，福建省机械工程学会标准委员会委员
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Paper Publications
The effects of abrasive yielding on the polishing of SiC wafers using a semi-fixed flexible pad.2014JCR-大类-工程技术-四区:PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE,2014,
Phase Transformation of Monocrystalline Silicon Induced by Polishing With Diamond Abrasives.2014JCR-大类-工程技术-四区:IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING,2014,
Fabrication and application of gel-bonded ultrafine diamond abrasive tools.EI正刊:Jixie Gongcheng Xuebao/Journal of Mechanical Engineering,2014,
The Research of Reactivity between Nano-abrasives and Sapphire during Polishing Process.INTEGRATED FERROELECTRICS,2015,
The effects of abrasive yielding on the polishing of SiC wafers using a semi-fixed flexible pad.PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE,2015,
Phase Transformation of Monocrystalline Silicon Induced by Polishing With Diamond Abrasives.IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING,2015,
Study on planarization machining of sapphire wafer with soft-hard mixed abrasive through mechanical chemical polishing.2015JCR-大类-工程技术2区:APPLIED SURFACE SCIENCE,2015,
Preparation and Characterization of Zirconia-Coated Nanodiamonds as a Pt Catalyst Support for Methanol Electro-Oxidation.2015JCR-大类-工程技术2区:Nanomaterials,2015,
Preparation and Characterization of Zirconia-Coated Nanodiamonds as a Pt Catalyst Support for Methanol Electro-Oxidation.2015JCR-大类-工程技术2区:Nanomaterials,2015,
Study on planarization machining of sapphire wafer with soft-hard mixed abrasive through mechanical chemical polishing.2015JCR-大类-工程技术2区:APPLIED SURFACE SCIENCE,2015,
A comparative study on the material removal mechanisms of 6H-SiC polished by semi-fixed and fixed diamond abrasive tools.WEAR,2016,
Removal mechanism of sapphire substrates (0001, 1120 and 1010) in mechanical planarization machining.2016JCR大类-工程技术2区:CERAMICS INTERNATIONAL,2016,
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