廖信江

个人信息Personal Information

讲师(高校)

学历:博士研究生

学位:工学博士学位

入职时间:2021-03-15

所在单位:机电及自动化学院

办公地点:综合实验大楼A310

电子邮箱:

科研成果

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发表论文

[1] Z. Yang, H. Huang, X. Liao*, Z. Lai, Z. Xu, Y. Zhao, Wire Bow In Situ Measurement for Monitoring the Evolution of Sawing Capability of Diamond Wire Saw during Slicing Sapphire, Materials. 17 (2024) 2134. (通讯)

[2] Z. Xu, X. Liao, X. Chen, Z. Lai, H. Huang, Mechanical model of diamond wire sawing for curved surfaces, Int. J. Mech. Sci. (2024) 109379. 中科院1区,TOP期刊,IF 7.1

[3] Z. Lai, X. Liao, H. Yang, Z. Hu, H. Huang, Experimental study on the formation mechanism of saw marks in wire sawing, Int. J. Mech. Sci. 265 (2024) 108894.中科院1区,TOP期刊,IF 7.1

[4] Z. Xu, H. Huang, C. Cui, X. Liao, M. Wu, Z. Xue, Complex-shaped metal parts high efficiency sawing with diamond wire, Int. J. Mech. Sci. (2023) 108306. (中科院1区,TOP期刊,IF 7.1

[5] Z. Lai, H. Huang, Z. Hu, X. Liao, Dynamic model and machining mechanism of wire sawing, J. Mater. Process. Technol. 311 (2022) 117820. (中科院1区,TOP期刊,IF 6.7

[6] Z. Yang, H. Huang, X. Liao*, Influence of cutting parameters on wear of diamond wire during multi-wire rocking sawing with reciprocating motion, Front. Mech. Eng. (2022) 978714. (通讯)

[7] X. Liao, Z. Liu, R. Liu, D. Mu, Microstructure evolution and joining strength of diamond brazed on Ti-6Al-4V substrates using Ti-free eutectic Ag-Cu filler alloy, Diam. Relat. Mater. 127 (2022) 109198. 

[8] 徐西鹏, 黄辉, 胡中伟, 崔长彩, 罗求发, 廖信江, 磨粒工具的研究现状及发展趋势, 机械工程学报. 58 (2022) 2–20.机械中文顶刊

[9] S. Shi, Y. Yu, N. Wang, Y. Zhang, W. Shi, X. Liao, N. Duan, Investigation of the anisotropy of 4H-SiC materials in nanoindentation and scratch experiments, Materials. 15 (2022) 2496. 

[10] Z. Liu, X. Liao, W. Fu, D. Mu, X. Xu, H. Huang, Microstructures and bonding strength of synthetic diamond brazed by near-eutectic Ag–Cu–in–Ti filler alloy, Mater. Sci. Eng. A. 790 (2020) 139711. 中科院1区,TOP期刊,IF 6.4

[11] Q. He, Y. Zhang, N. Duan, H. Huang, D. Mu, X. Liao*, Wetting behaviours and interfacial characteristics of Co-binder sintered polycrystalline diamond by SnTi active solder, Powder Technol. 376 (2020) 643–651. 通讯,TOP期刊,IF 5.2

[12] Y. Zhang, X. Liao§, Q. Lin, D. Mu, J. Lu, H. Huang, H. Huang, Reactive Infiltration and Microstructural Characteristics of Sn-V Active Solder Alloys on Porous Graphite, Materials. 13 (2020) 1532. (共同一作)

[13] J. Chen, X. Liao, Q. Lin, D. Mu, H. Huang, X. Xu, H. Huang, Reactive wetting of binary Sn–Cr alloy on polycrystalline chemical vapour deposited diamond at relatively low temperatures, Diam. Relat. Mater. 92 (2019) 92–99. 

[14] X. Liao, Q. He, Q. Lin, D. Mu, H. Huang, H. Huang, Reactive Wetting of Sn-V Solder Alloys on Polycrystalline CVD Diamond, Appl. Surf. Sci. 504 (2019) 144508. 中科院1区,TOP期刊,IF 6.7

[15] X. Liao, D. Mu, W. Fu, H. Huang, H. Huang, Low-temperature wetting mechanisms of polycrystalline chemical vapour deposition (CVD) diamond by Sn-Ti solder alloys, Mater. Des. 182 (2019) 108039. 中科院1区,TOP期刊,IF 8.4

[16] J. Chen, D. Mu, X. Liao, G. Huang, H. Huang, X. Xu, H. Huang, Interfacial microstructure and mechanical properties of synthetic diamond brazed by Ni-Cr-P filler alloy, Int. J. Refract. Met. Hard Mater. 74 (2018) 52–60. 

[17] X. Liao, D. Mu, J. Wang, G. Huang, H. Huang, X. Xu, H. Huang, Formation of TiC via interface reaction between diamond grits and Sn-Ti alloys at relatively low temperatures, Int. J. Refract. Met. Hard Mater. 66 (2017) 252–257. 


授权发明专利

[1] 廖信江;穆德魁;贺琦琦;刘卓;黄辉;徐西鹏;一种低温钎焊立方氮化硼磨粒的方法,2020-12-01,中国,ZL201810244859.5

[2] 黄辉;崔晨;廖信江;杨浩;一种用于钎焊线锯的静电上砂装置,2022-1-29,中国,ZL202210468197.6

[3] 穆德魁;陈金昶;廖信江;黄辉;徐西鹏;一种含Cr的低温钎焊金刚石及其钎料合金,2020-08-07

[4] 黄辉;崔长彩;廖信江;李慧慧;一种晶圆最大加工损伤的精准定位方法,2022-2-8,中国,ZL201910721403.8

[5] 穆德魁;刘卓;何启文;廖信江;一种大粒径金刚石磨具的磨粒表面微去除方法及该大粒径金刚石磨具的制造方法, 2021-9-21, 中国,ZL202010146170.6

[6]  冯魁元;廖信江;穆德魁 ; 一种低温钎焊蓝宝石的方法, 2021-02-02, 中国,ZL201810802212.X