赖志远，华侨大学制造工程研究院。博士毕业于华侨大学，主要从事脆性材料高效精密智能加工、金刚石线锯加工技术研究，在International Journal of Mechanical Sciences、Journal of Materials Processing Technology、Journal of Manufacturing Processes、International Journal of Refractory Metals and Hard Materials、Precision Engineering、Materials Science in Semiconductor Processing、The International Journal of Advanced Manufacturing Technology、IEEE Transactions on Semiconductor Manufacturing 等业内高水平刊物上发表论文12篇；授权中国发明专利3项。获2023年度省科技进步奖一等奖（排名：9/10）。入选2024年省优秀博士后支持专项。

教育与工作经历

2024.7-至今              华侨大学制造工程研究院                         讲师/博士后

2016.9-2024.12        华侨大学制造工程研究院                         工学博士

2012.9-2016.7          南京航空航天大学机电学院                      工学学士

获奖情况

[1] 获2023年度福建省科技进步奖一等奖（排名：9/10）

[2] 获2024年福建省优秀博士后专项支持

[3] 第八届福建省“互联网+”大学生创新创业大赛（产业命题赛道）铜奖（4/7）

代表文章：

[1] Lai Z, Liao X, Xu Z, et al. Three-dimensional dynamic model of wire sawing for saw marks control[J]. International Journal of Mechanical Sciences, 2025, 286:109892.（SCI一区Top，IF = 7.3）

[2] Lai Z, Liao X, Yang H, Hu Z, Huang H. Experimental study on the formation mechanism of saw marks in wire sawing[J]. International Journal of Mechanical Sciences, 2024, 265:108894. （SCI一区Top，IF = 7.3）

[3] Lai Z, Huang H, Hu Z, Liao X. Dynamic model and machining mechanism of wire sawing[J]. Journal of Materials Processing Technology, 2023, 311:117820. （SCI一区Top，，IF = 6.3）

[4] Lai Z, Hu Z, Fang C, et al. Research on factors affecting wear uniformity of the wheels in the double-sided lapping[J]. Journal of Manufacturing Processes, 2020, 50:653-662. （SCI一区Top，IF = 6.2）

[5] Lai Z, Hu Z, Fang C, et al. Study on the wear characteristics of a lapping wheel in double-sided lapping based on the trajectory distribution[J]. IEEE Transactions on Semiconductor Manufacturing, 2019, 32(3): 352-358. （SCI三区，IF = 2.7）

[6] Wu M, Wu Y, Lai Z ,et al. Design and experimental validation of non-trimming polishing plate for high wear-resistant workpieces based on optimized motion trajectory distribution[J]. Precision Engineering, 2025, 93:551-558.（SCI二区，IF = 3.5）

[7] Yang H, Huang H, Liao X, Lai Z, Duan N, Xu Z. Microstructural insights and performance evaluation of low-damage brazed diamond wire with a tungsten core[J]. International Journal of Refractory Metals and Hard Materials, 2025, 128:107081.（SCI二区，IF = 4.2）

[8] Xu Z, Liao X, Chen X, Lai Z, Huang H.Mechanical model of diamond wire sawing for curved surfaces[J]. International Journal of Mechanical Sciences, 2024, 276:109379.（SCI一区Top，IF = 7.3）

[9] Hu Z, Chen Y, Lai Z, Yu Y, Xu X, Peng Q, Zhang L. Coupling of double grains enforces the grinding process in vibration-assisted scratch: Insights from molecular dynamics[J]. Journal of Materials Processing Technology, 2022, 304:117551. （SCI一区Top，IF = 6.3）

[10] Chen Y, Hu Z, Yu Y, Lai Z, Zhu J, Xu X, Peng Q. Processing and machining mechanism of ultrasonic vibration-assisted grinding on sapphire[J]. Materials Science in Semiconductor Processing, 2022, 142:106470. （SCI二区，IF = 4.1）