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个人信息Personal Information
讲师（高校）
性别：男
学历：博士研究生
学位：工学博士学位
所在单位：制造工程研究院
办公地点：综合实验大楼A317
电子邮箱：
在职信息：在岗
- Design and experimental validation of non-trimming polishing plate for high wear-resistant workpieces based on optimized motion trajectory distribution.Precision Engineering,
- Microstructural insights and performance evaluation of low-damage brazed diamond wire with a tungsten core.International Journal of Refractory Metals and Hard Materials,
- AAC theory for ultrasonic vibration-assisted grinding.The International Journal of Advanced Manufacturing Technology,
- Wire Bow In Situ Measurement for Monitoring the Evolution of Sawing Capability of Diamond Wire Saw during Slicing Sapphire.Materials,
- Mechanical model of diamond wire sawing for curved surfaces.International Journal of Mechanical Sciences,
- Coupling of Double Grains Enforces the Grinding Process in Vibration-assisted Scratch: Insights from Molecular Dynamics.Journal of Materials Processing Technology,
- Processing and machining mechanism of ultrasonic vibration-assisted grinding on sapphire.Materials Science in Semiconductor Processing,
- Study on the Wear Characteristics of a Lapping Wheel in Double-Sided Lapping Based on the Trajectory Distribution.IEEE Transactions on Semiconductor Manufacturing,
- Research on factors affecting wear uniformity of the wheels in the double-sided lapping.Journal of Manufacturing Processes,
- Dynamic model and machining mechanism of wire sawing.Journal of Materials Processing Technology,