论文成果
Wire Bow In Situ Measurement for Monitoring the Evolution of Sawing Capability of Diamond Wire Saw during Slicing Sapphire
  • 点击次数:

  • 发表刊物:

    Materials

  • 是否译文:

上一条:AAC theory for ultrasonic vibration-assisted grinding

下一条:Mechanical model of diamond wire sawing for curved surfaces