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发表刊物:JOURNAL OF SOL-GEL SCIENCE AND TECHNOLOGY
是否译文:否
发表时间:2020-12-01
上一条:【一作-SCI】Controllable material removal behavior of 6H-SiC wafer in nanoscale polishing
下一条:【一作-SCI】Removal mechanism of sapphire substrates (0001, 11-20 and 10-10) in mechanical planarization machining