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罗求发
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副教授
硕士生导师
- 性别：男
- 学历：博士研究生
- 学位：工学博士学位
- 入职时间：2020-01-14
- 所在单位：机电学院/制造工程研究院
- 办公地点：综合实验大楼A314
- 电子邮箱：1be4d90a54e296d434b54bc07f3799f219cbfd011631fe662aa28a1eef1bd7052be36af53c3e29f306d6a6cf5ed5483d4ac77da24bc1b613a3f547ff289683e24ad493260ee5a66b8d7b6ed0a769014c2bfb7f1d0f63177c1a1360c5743b89c7e297e090c2ea895351b52978114b6119a857a8bbb0365c4f78a47c58f3456475
- 在职信息：挂职
- 学科：机械制造及其自动化
访问量：
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[1]【一作-SCI】Fabrication and Application of Grinding Wheels with Soft and Hard Composite Structures for Silicon Carbide Substrate Precision Processing.Materials,2024,
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[2]【一作-EI】碳化硅衬底磨抛加工技术的研究进展与发展趋势.湖南大学学报（自然科学版）,2024,
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[3]【一作-SCI】Tribochemical mechanisms of abrasives for SiC and sapphire substrates in nanoscale polishing.Nanoscale,2023,
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[4]【一作-SCI】Sol-gel polishing technology for extremely hard semiconductor substrates.INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,2022,
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[5]【一作-EI】单层磨料凝胶抛光垫的加工性能研究.表面技术,2021,
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[6]【一作-SCI】Controllable material removal behavior of 6H-SiC wafer in nanoscale polishing.Applied Surface Science,2021,
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[7]【一作-SCI】Fabrication of a sol-gel polishing tool for green manufacturing of the seal stone.JOURNAL OF SOL-GEL SCIENCE AND TECHNOLOGY,2020,
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[8]【一作-SCI】Removal mechanism of sapphire substrates (0001, 11-20 and 10-10) in mechanical planarization machining.Ceramics international,2017,
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[9]【一作-SCI】Study on the processing characteristics of SiC and sapphire substrates polished by semi-fixed and fixed abrasive tools.Tribology international,2016,
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[10]【一作-SCI】A comparative study on the material removal mechanisms of 6H-SiC polished by semi-fixed and fixed diamond abrasive tools.Wear,2016,
