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发表刊物:Tribology international
是否译文:否
发表时间:2016-12-01
上一条:【一作-SCI】Removal mechanism of sapphire substrates (0001, 11-20 and 10-10) in mechanical planarization machining
下一条:【一作-SCI】A comparative study on the material removal mechanisms of 6H-SiC polished by semi-fixed and fixed diamond abrasive tools