Design and experimental validation of non-trimming polishing plate for high wear-resistant workpieces based on optimized motion trajectory distribution.Precision Engineering,

Microstructural insights and performance evaluation of low-damage brazed diamond wire with a tungsten core.International Journal of Refractory Metals and Hard Materials,

AAC theory for ultrasonic vibration-assisted grinding.The International Journal of Advanced Manufacturing Technology,

Wire Bow In Situ Measurement for Monitoring the Evolution of Sawing Capability of Diamond Wire Saw during Slicing Sapphire.Materials,

Mechanical model of diamond wire sawing for curved surfaces.International Journal of Mechanical Sciences,

Coupling of Double Grains Enforces the Grinding Process in Vibration-assisted Scratch: Insights from Molecular Dynamics.Journal of Materials Processing Technology,

Processing and machining mechanism of ultrasonic vibration-assisted grinding on sapphire.Materials Science in Semiconductor Processing,

Study on the Wear Characteristics of a Lapping Wheel in Double-Sided Lapping Based on the Trajectory Distribution.IEEE Transactions on Semiconductor Manufacturing,

Research on factors affecting wear uniformity of the wheels in the double-sided lapping.Journal of Manufacturing Processes,

Dynamic model and machining mechanism of wire sawing.Journal of Materials Processing Technology,