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Huang Hui
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Paper Publications
Development of a brazed diamond wire for slicing single-crystal SiC ingots.INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,2017,
Effect of wire vibration on the materials loss in sapphire slicing with the fixed diamond wire.MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING,2017,
An Experimental Research on the Force and Energy During the Sapphire Sawing Using Reciprocating Electroplated Diamond Wire Saw.JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME,2017,
The influence of crystallographic orientation on wear characteristics during single abrasive diamond grit scratching on sapphire.INDUSTRIAL LUBRICATION AND TRIBOLOGY,2018,
Parameter Optimization for Improvement in Biomachining Performance.Transactions of Nanjing University of Aeronautics and Astronautics,2019,
Dynamic model and machining mechanism of wire sawing.Journal of Materials Processing Technology,2022,(311):117820.
Analysis of The Removal Mechanism of Ferroalloy by Acidithiobacillus Ferrooxidans.Procedia CIRP,2022,(110):14-19.
A novel approach to obtain near damage-free surface/subsurface in machining of single crystal 4H-SiC substrate using pure metal mediated friction.Applied Surface Science,2022,588152963.
Measurement and simulation calculation of wire bow angle during the diamond wire saw process.The International Journal of Advanced Manufacturing Technology,2021,(120):7197–7204.
多线摇摆往复式线锯切割加工运动的理论及实验研究.机械工程学报,2020,(56):219-228.
Development of a brazed diamond wire for slicing single-crystal SiC ingots.2016JCR大类-工程技术3区:INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY,2016,189-199.
An Experimental Research on the Force and Energy During the Sapphire Sawing Using Reciprocating Electroplated Diamond Wire Saw.2016JCR大类-工程技术3区:JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME,2016,
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