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罗求发

Personal Information

Associate professor
Supervisor of Master's Candidates

Paper Publications

【一作SCI-二区top】Study on tribochemical reaction behavior induced by abrasives scratching in SiC wafer backside thinning.Wear,2026,206589.
【一作SCI】Study on electrochemical mechanical polishing of Silicon Carbide substrates with controllable material removal behavior.Journal of Materials Research and Technology,2026,7212-7223.
【一作SCI】Preparation and properties of conductive fixed abrasive polishing discs for electrochemical mechanical polishing of SiC substrates.Materials Science in Semiconductor Processing,2026,110710.
【一作SCI】Material removal behavior of SiC wafer studied by nano-scratching in aqueous medium.Diamond and Related Materials,2026,113588.
【一作-SCI】Tribochemical mechanisms of abrasives for SiC and sapphire substrates in nanoscale polishing.Nanoscale,2023,15675.

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