Current position: Home >> Scientific Research >> Patents
罗求发

Personal Information

Associate professor  
Supervisor of Master's Candidates  

Patents

一种用于半导体晶圆表面的磨削方法

Hits:

Affilication of Author(s):制造工程研究院

Disigner of the Invention:LJ,KCM,Huang Hui,XXP

Type of Patent:发明专利

State of Patent:专利授权

Application Number:202410263207.1

Service Invention or Not:no

Application Date:2024-03-08

First Author:LQF

Pre One:一种基于磨粒放电诱导去除半导体晶圆表面的抛光方法

Next One:一种诱导工件摩擦化学反应的砂轮结块及其制备方法