NAME

罗求发

Patents

一种磨粒放电诱导去除绝缘晶圆表面的磨抛加工方法
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  • Affilication of Author(s):

    制造工程研究院

  • Disigner of the Invention:

    LJ,KCM,Huang Hui,XXP

  • Type of Patent:

    发明专利

  • State of Patent:

    专利授权

  • Application Number:

    202410244827.0

  • Service Invention or Not:

    no

  • First Author:

    LQF

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