NAME

罗求发

Patents

一种基于磨粒放电诱导去除半导体晶圆表面的抛光方法
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  • Affilication of Author(s):

    制造工程研究院

  • Disigner of the Invention:

    LJ,KCM,Huang Hui,XXP

  • Type of Patent:

    发明专利

  • State of Patent:

    专利申请

  • Application Number:

    202410248104.8

  • Service Invention or Not:

    no

  • First Author:

    LQF

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